VPIphotonics at SPIE Photonics West 2012
Meet our modeling experts on 21-26 January in San Francisco and attend their presentations in frame of the technical program!
Technical Contributions presented at OPTO on Photonic Integration and Optical Communications
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Detailed modeling of integrated IQ-transmitters for 100-G+ applications (invited)
A. Richter, C. Arellano, D. Carrara*, S. Mingaleev, E. Sokolov, I. Koltchanov (*with CNRS, Telecom SudParis)
presented on Wed, Jan-25 2012,
in Conference 8284 (Next-Generation Optical Communication: Components, Sub-Systems, and Systems),
Session 6 (3:40pm - 5:10pm)Abstract:We present techniques for modeling the physics and systems-level characteristics of integrated IQ-transmitters for 100G+ applications and emphasize important design aspects. Using time-and-frequency-domain modeling (TFDM) of Photonic Integrated Circuits (PIC), we present a detailed IQ-transmitter model based on the physics and setup of active and passive subcomponents. With this, we link characteristics of subcomponents (bending loss of waveguides, phase changes in MMI couplers, sweep-out time of EAMs) to systems-level characteristics of the integrated IQ-transmitter (extinction ratio, modulation bandwidth, chirp). Further, a behavioral transmitter model is introduced and utilized to assess electrical driving requirements (allowed jitter, noise, synchronization offset).
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Time-and-Frequency-Domain Modeling (TFDM) of hybrid photonic integrated circuits (invited)
C. Arellano, I. Koltchanov, A. Richter, E. Sokolov, S. Mingaleev
presented on Thu, Jan-26 2012,
in Conference 8265 (Optoelectronic Integrated Circuits XIV),
Session 7 (2:00pm - 3:50pm)Abstract: This work addresses the efficient modeling of hybrid large-scale photonic integrated circuits (PICs) comprising both, active and passive sub-elements. We describe a new modeling approach, the time-and-frequency-domain modeling (TFDM) that improves accuracy, memory requirements and simulation speed in comparison with traditional pure time-domain method. In TFDM, clusters of connected linear PIC elements are modeled in frequency domain, while interconnections between such clusters and non-passive PIC elements are modeled in the time domain. Behavioral models of the fundamental building blocks of PICs are presented and combined in several application examples showing the robustness of the entire modeling framework for PICs.
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